JPH0186273U - - Google Patents
Info
- Publication number
- JPH0186273U JPH0186273U JP18326587U JP18326587U JPH0186273U JP H0186273 U JPH0186273 U JP H0186273U JP 18326587 U JP18326587 U JP 18326587U JP 18326587 U JP18326587 U JP 18326587U JP H0186273 U JPH0186273 U JP H0186273U
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- film layer
- ceramic
- wiring board
- ceramic insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183265U JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183265U JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0186273U true JPH0186273U (en]) | 1989-06-07 |
| JPH06851Y2 JPH06851Y2 (ja) | 1994-01-05 |
Family
ID=31474694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987183265U Expired - Lifetime JPH06851Y2 (ja) | 1987-11-30 | 1987-11-30 | セラミック多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06851Y2 (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270897A (ja) * | 1985-05-25 | 1986-12-01 | 株式会社住友金属セラミックス | 多層回路基板 |
-
1987
- 1987-11-30 JP JP1987183265U patent/JPH06851Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270897A (ja) * | 1985-05-25 | 1986-12-01 | 株式会社住友金属セラミックス | 多層回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06851Y2 (ja) | 1994-01-05 |